ELECTROMIGRATION INDUCED EDGE VOID DYNAMICS ON THE INTERCONNECT SURFACE

Six Fold Crystal Symmetry, {111} Planes in FCC


For 15° tilt angle, the edge-void regardless the intensity of the electron wind transform its shape into an inclined kink-form and migrates towards the cathode end with increasing in amplitude. The wave front becomes more and more steep on the leeward side, as can be seen in Figure, during the traveling. At the end, it may generate a step like surface morphology. After the step formed it may move towards cathode or stays stable. The situation may be more critical at very high current densities χ≥50 , and low aspect ratios , because of this steady increase intensity combining with steeping of the lee side, may cause substantial decrease in the cross section of the interconnect line and eventually circuit break down takes place by local joule heating.