ELECTROMIGRATION INDUCED EDGE VOID DYNAMICS ON THE INTERCONNECT SURFACE Four Fold Crystal Symmetry, {100} Planes in FCC We also investigated the case where the tilt angle is θ=30 degrees, and the general
evolution behavior is demonstrated in Figure for low and moderate electron
wind intensities χ= 5-10. The void shows some shape variations while decaying
and disappearing completely without leaving any trace on the otherwise flat surface.
However, at very high electron winds χ≥ 50 a round shape daughter void may be
created, which migrates towards the cathode edge. There may be multiple daughter
void emanating from the same source at later times. |
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