In the case of θ= 45 degrees tilt angle, the edgevoid, which is initially established on the flat surface starts to disappear after turning on the applied electric field, at low and moderate electron wind intensities χ≤ 25 without leaving any trace. The intensity the applied electric field and the degree of diffusion anisotropy affect only the total decay time of the edgevoid. At very high electron wind intensities χ≥ 50, interconnects having 45° tilt orientation show EM induced voiding having extremely short life time. In this high EM regime, the edge-void perturbation is completely disappearing from the surface after popping up few, small and short leaving EM voids.